Plater

The Plater in the Electroplating Lab performs production plating operations on highprecision RF connector components while maintaining proper chemical bath conditions. This role combines handson plating with routine wet chemistry control to ensure consistent coating quality and compliance with aerospace and NADCAP requirements.

• Perform electroplating operations on small, precision components (e.g., contacts, connector parts) using processes such as gold and nickel plating
• Prepare parts for plating including cleaning, masking, racking, and fixturing
• Operate and monitor plating baths, maintaining parameters such as temperature, pH, and current density (ASF)
• Conduct basic wet chemistry checks (e.g., titrations, pH) and make routine chemical additions per specifications
• Inspect plated parts for coverage, thickness, and defects; identify and address basic process issues
• Maintain production records, bath logs, and lot traceability in accordance with NADCAP and quality requirements
• Follow all safety, environmental, and chemical handling procedures

• High school diploma or equivalent required
• 1–3 years of electroplating or metal finishing experience in a production environment preferred
• Working knowledge of plating processes and basic bath chemistry control
• Ability to follow detailed procedures in a regulated (AS9100/NADCAP) environment
• Strong attention to detail and ability to work with small components
• Basic math and documentation skills

PI284674801