Nvidia Corporation
Santa Clara, CA
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction. Prior knowledge of Package related Failure Analysis is beneficial. What you will be doing: Package Development & Prototyping: Drive the process, mechanical, thermal, and material evaluation of the latest IC packages. Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases. Material Characterization: Pioneer new packaging & die-level processing methodologies and evaluate innovative...